导流板对数据中心气流组织优化及节能的模拟与实验研究
DOI:
https://doi.org/10.18686/cncest.v2i1.97关键词:
数据中心；气流组织；ANSYS模拟；导流板；能效提升摘要
数据中心气流组织直接影响数据机房的室温控制及供冷设备的能效。鉴于数据机房底层服务器由于距离开孔地板过近、气流的水平速度分量小，导致下层服务器风量不足、冷却效果较差问题，本文通过安装导流板的方式提升机柜级别垂直方向的气流均匀性，从而改善机房内整体气流组织效果。基于多工况实验和数值模拟相结合的方法优化数据中心的导流板结构尺寸及布置形式。研究结果表明，对于单侧机柜送风，建议在开孔地板下方安装宽度为100 mm、角度为45°的导流板；对于两侧机柜送风，导流板宽度为100 mm且与开孔地板呈30°角度安装可以获得最佳的气流组织效果，机柜底层服务器的进风量明显增加，降低了发生局部热点的风险。最后，基于最优的导流板布置形式对某真实数据中心机房的气流组织开展ANSYS模拟仿真，对比实际未安装导流板的情况，导流板的优化布置使机柜的进风量增加16.98%，提升机房空调能效达1.98%。
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