低温等离子体抛光技术在芯片材料加工中的研究进展
DOI:
https://doi.org/10.18686/cncest226关键词:
低温等离子体抛光芯片材料；等离子体辅助抛光（PAP）；等离子体电解处理辅助抛光（PEP-MP）；等离子体化学汽化加工（PCVM）；等离子体选择刻蚀技术（PASE）摘要
低温等离子体抛光技术利用其高度电离的特性，能够精确去除芯片材料表面的微小缺陷和杂质，提高芯片材料的平整度和光洁度，减少机械损伤和亚表面损伤，同时具有较高的材料去除率。本文综述了等离子体抛光技术在芯片材料加工领域的应用现状、优势及其局限性。具体探讨了等离子体辅助抛光（PAP）、等离子体化学气化加工（PCVM）、等离子体电解处理辅助抛光（PEP-MP）和等离子体选择刻蚀（PASE）等工艺技术的原理及应用，分析了其优势与局限性，最后对等离子体芯片抛光技术的发展进了展望，旨在为芯片制造工艺的持续改进和微电子产业的未来发展提供有益参考。
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